Advances in Surface Mount Technology (SMT) have in some cases reduced the
need for conventional thru-hole and mixed technology PCB assembly. However,
responding to the demands of our clients we provide a complete range of PCB
assembly services for total flexibility.
Low to Medium Volume
RoHS or Non RoHS
Speedprint Avi with twin Camera Technology, 01005 to 0.3mm pitch, 12.5sec cycle time capability.
Paste level monitoring system accurately applies the solder paste only where it is needed.
Europlacer IIneo II, dual-head, component placement machine capable of handling PCB's up to 700mmx600mm.
Super fast, but highly accurate (standard 35μm (QFP) to 60μm (Chip)) placements of up to 28k components per hour and the flexibility to handle the most challenging component shapes.
Heller Mk III, 7 zone reflow oven with 25% higher airflow for enhanced temperature uniformity, repeatability and higher load handling as well as being more environmentally friendly.
Thru-Hole & Conventional Assembly
Thru-hole components are soldered by hand by our highly skilled assembly team, trained to IPC-A-610 Class 3 inspection standards.
RoHS compliant Blundell System 300 flow solder machine for larger volume assemblies.